sep.1998 dimensions inches millimeters a 3.70 94.0 b 3.150 0.01 80.0 0.25 c 1.57 40.0 d 1.34 34.0 e 1.22 max. 31.0 max. f 0.90 23.0 g 0.85 21.5 h 0.79 20.0 j 0.71 18.0 dimensions inches millimeters k 0.67 17.0 l 0.63 16.0 m 0.51 13.0 n 0.47 12.0 p 0.28 7.0 q 0.256 dia. dia. 6.5 r 0.16 4.0 s m5 metric m5 description: mitsubishi igbt modules are de- signed for use in switching applica- tions. each module consists of two igbts in a half-bridge configuration with each transistor having a re- verse-connected super-fast recov- ery free-wheel diode. all compo- nents and interconnects are iso- lated from the heat sinking base- plate, offering simplified system as- sembly and thermal management. features: u low drive power u low v ce(sat) u discrete super-fast recovery free-wheel diode u high frequency operation u isolated baseplate for easy heat sinking applications: u ac motor control u motion/servo control u ups u welding power supplies ordering information: example: select the complete part module number you desire from the table below -i.e. CM75DY-12H is a 600v (v ces ), 75 ampere dual igbt module. type current rating v ces amperes volts (x 50) cm 75 12 outline drawing and circuit diagram mitsubishi igbt modules CM75DY-12H high power switching use insulated type b f f c k r r r d a e g n h h j p m c1 e1 (3 typ.) (2 typ.) (3 typ.) e2 c2e1 e2 e1 c1 e2 tab#110 t=0.5 g1 e2 g2 c2e1 g1 g2 s - m5 thd q - dia. l
sep.1998 mitsubishi igbt modules CM75DY-12H high power switching use insulated type absolute maximum ratings, t j = 25 c unless otherwise specified ratings symbol CM75DY-12H units junction temperature t j C40 to 150 c storage temperature t stg C40 to 125 c collector-emitter voltage (g-e short) v ces 600 volts gate-emitter voltage (c-e short) v ges 20 volts collector current (t c = 25 c) i c 75 amperes peak collector current i cm 150* amperes emitter current** (t c = 25 c) i e 75 amperes peak emitter current** i em 150* amperes maximum collector dissipation (t c = 25 c, t j 150 c) p c 310 watts mounting torque, m5 main terminal C 1.47 ~ 1.96 n m mounting torque, m6 mounting C 1.96 ~ 2.94 n m weight C 190 grams isolation voltage (main terminal to baseplate, ac 1 min.) v iso 2500 vrms *pulse width and repetition rate should be such that the device junction temperature (t j ) does not exceed t j(max) rating. **represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (fwdi). static electrical characteristics, t j = 25 c unless otherwise specified characteristics symbol test conditions min. typ. max. units collector-cutoff current i ces v ce = v ces , v ge = 0v C C 1.0 ma gate leakage current i ges v ge = v ges , v ce = 0v C C 0.5 m a gate-emitter threshold voltage v ge(th) i c = 7.5ma, v ce = 10v 4.5 6.0 7.5 volts collector-emitter saturation voltage v ce(sat) i c = 75a, v ge = 15v C 2.1 2.8** volts i c = 75a, v ge = 15v, t j = 150 c C 2.15 C volts total gate charge q g v cc = 300v, i c = 75a, v ge = 15v C 225 C nc emitter-collector voltage v ec i e = 75a, v ge = 0v C C 2.8 volts ** pulse width and repetition rate should be such that device junction temperature rise is negligible. dynamic electrical characteristics, t j = 25 c unless otherwise specified characteristics symbol test conditions min. typ. max. units input capacitance c ies C C 7.5 nf output capacitance c oes v ge = 0v, v ce = 10v C C 2.6 nf reverse transfer capacitance c res C C 1.5 nf resistive turn-on delay time t d(on) C C 120 ns load rise time t r v cc = 300v, i c = 75a, C C 300 ns switching turn-off delay time t d(off) v ge1 = v ge2 = 15v, r g = 8.3 w C C 200 ns times fall time t f C C 300 ns diode reverse recovery time t rr i e = 75a, di e /dt = C150a/ m s C C 110 ns diode reverse recovery charge q rr i e = 75a, di e /dt = C150a/ m s C 0.2 C m c thermal and mechanical characteristics, t j = 25 c unless otherwise specified characteristics symbol test conditions min. typ. max. units thermal resistance, junction to case r th(j-c) per igbt C C 0.40 c/w thermal resistance, junction to case r th(j-c) per fwdi C C 0.90 c/w contact thermal resistance r th(c-f) per module, thermal grease applied C C 0.075 c/w
sep.1998 collector-emitter voltage, v ce , (volts) collector current, i c , (amperes) output characteristics (typical) 150 0246810 75 25 0 v ge = 20v 15 12 11 8 7 t j = 25 o c 50 100 125 10 9 gate-emitter voltage, v ge , (volts) collector current, i c , (amperes) transfer characteristics (typical) 150 0 4 8 12 16 20 100 75 50 25 0 v ce = 10v t j = 25? t j = 125? 125 collector-current, i c , (amperes) collector-emitter saturation voltage, v ce(sat) , (volts) collector-emitter saturation voltage characteristics (typical) 5 0 25 50 75 100 150 4 3 2 1 0 125 v ge = 15v t j = 25? t j = 125? gate-emitter voltage, v ge , (volts) collector-emitter saturation voltage, v ce(sat) , (volts) collector-emitter saturation voltage characteristics (typical) 10 0 4 8 12 16 20 8 6 4 2 0 t j = 25? i c = 30a i c = 150a i c = 75a 0 0.8 1.6 2.4 3.2 4.0 10 0 emitter-collector voltage, v ec , (volts) free-wheel diode forward characteristics (typical) 10 2 10 3 emitter current, i e , (amperes) t j = 25? 10 1 collector-emitter voltage, v ce , (volts) capacitance, c ies , c oes , c res , (nf) capacitance vs. v ce (typical) 10 -1 10 0 10 2 10 2 10 1 10 0 10 -1 v ge = 0v 10 1 c ies c oes c res emitter current, i e , (amperes) reverse recovery time, t rr , (ns) reverse recovery characteristics (typical) 10 3 10 0 10 1 10 2 10 2 10 0 t rr i rr di/dt = -150a/ m sec t j = 25? 10 1 10 0 10 -1 reverse recovery current, i rr , (amperes) 10 1 10 2 collector current, i c , (amperes) switching time, (ns) half-bridge switching characteristics (typical) 10 3 10 0 10 1 10 2 10 1 10 0 t d(off) t d(on) t r v cc = 300v v ge = ?5v r g = 8.3 w t j = 125? t f 10 2 gate charge, q g , (nc) gate-emitter voltage, v ge , (volts) gate charge, v ge 20 0 50 100 150 200 250 16 12 8 4 0 v cc = 200v i c = 75a 300 v cc = 300v mitsubishi igbt modules CM75DY-12H high power switching use insulated type
sep.1998 mitsubishi igbt modules CM75DY-12H high power switching use insulated type time, (s) normalized transient thermal impedance, z th(j-c) transient thermal impedance characteristics (igbt) 10 1 10 -5 10 -4 10 -3 10 0 10 -1 10 -2 10 -3 10 -3 10 -2 10 -1 10 0 10 1 single pulse t c = 25 c per unit base = r th(j-c) = 0.4 c/w z th = r th ?(normalized value) 10 -1 10 -2 10 -3 time, (s) normalized transient thermal impedance, z th(j-c) transient thermal impedance characteristics (fwdi) 10 1 10 -5 10 -4 10 -3 10 0 10 -1 10 -2 10 -3 10 -3 10 -2 10 -1 10 0 10 1 single pulse t c = 25 c per unit base = r th(j-c) = 0.9 c/w z th = r th ?(normalized value) 10 -1 10 -2 10 -3
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